Exhibit Product Lists

Surface finishing for xEV

• UBM formation on aluminum electrode on wafer “TORYZA EL PROCESS”
• Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”
• Electroless plating process for dielectric heat radiation substrate (For power module)
• Electromagnetic interference shielding plating process for PPS “TOP EP PROCESS”
• Lead-free glass powder for electronic components
• Highly-reliable granular copper plating technology with high adhesion to molding materials “TOP CLUSTER AR”

Surface finishing for environmentally friendly

• Long bath life, high speed type electroless nickel plating solution “TOP NICORON LLM-LFS”
• Hexavalent chromium-free pre-treatment process “TOP ZECROM PLUS PROCESS”
• White color decorative trivalent chromium plating solution “TOP FINECHROME BLW”
• Fluoropolymer free coating solution (Non-adhesive, anti-dirt) “TOP CERARELEASE IG”