OKUNO’s plating and surface finishing technology for PWBs and IC substrates

Surface finishing technology to glass core substrates

• Highly adhesive plating process on glass “TORIZING PROCESS”
• Acid copper plating additive for through-hole filling to glass core substrates “TOP LUCINA GCS series”

Plating technology for wafer and power modules

• UBM formation on aluminum electrode on wafer “TORYZA EL PROCESS”
• Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”
• Acid copper plating additive for semiconductor wafer “TORYZA LCN series”
• Acid copper plating additive for Cu-Cu hybrid bonding “TORYZA LCN LXD”
• Electroless plating process for power modules

The latest surface finishing for IC substrates

• Electroless copper plating process to solve Weak-Micro Via for high connection reliability “OPC FLET PROCESS”
• Acid copper plating additive for high-current density, fine pattern via filling “TOP LUCINA NSV ADV”
• Acid copper plating additive for large diameter via filling “TOP LUCINA NSV LV”

The latest surface finishing for FPC

• For fine pattern formation, high joint reliability Electroless nickel/gold plating process
• Highly-reliable granular copper plating technology with high adhesion to molding materials “TOP CLUSTER AR”
• Acid copper plating additive to high aspect ratio “TOP LUCINA HLS”
• Lead-free glass flit for electronic components