OKUNO’s plating and surface finishing technology for semiconductor wafer and IC substrates
Surface finishing technology to glass core substrates
- Highly adhesive plating process on glass “TORIZING PROCESS”
- Acid copper plating additive for through-hole filling to glass core substrates “TOP LUCINA GCS series”
Plating technology for semiconductor wafer and IC substrates
- UBM formation on aluminum electrode on wafer “TORYZA EL PROCESS”
- Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”
- Acid copper plating additives for semiconductor wafer “TORYZA LCN series”
- Acid copper plating additive for Cu-Cu hybrid bonding “TORYZA LCN LXD”
- Acid copper plating additive for high-current density, fine pattern via filling “TOP LUCINA NSV ADV”
Acid copper plating additive for large diameter via filling “TOP LUCINA NSV LV”