OKUNO’s plating and surface finishing technology for PWBs and IC substrates
Plating technology for wafer
- Additive for acid copper plating for TSV filling “TORYZA LCN SV”
- Additive for acid copper plating for Cu pillar formation “TORYZA LCN SP”
- Additive for acid copper plating for low aspect ratio via and trench filling “TORYZA LCN SD ”
- Additive for acid copper plating for high-filling performance and thickness uniformity “TORYZA LCN FRV”
- Electroless Cu plating process ensuring high adhesion for glass substrates “PLOPX”
The latest surface finish for IC substrates
- Electroless Cu plating process for high connection reliability “OPC FLET PROCESS”
- Additive for acid copper plating for high thickness uniformity and via filling “TOP LUCINA HS5”
- Palladium residue remover applicable to fine patterns “OPC PALLADELETE S”
- Electroless Ni/Au process using reduced cobalt catalyzing solution “ICP-COA PROCESS”
The latest surface finish for PWB
- Additive for acid copper plating with high via-filling performance to large diameter holes “TOP LUCINA GAP”
- Additive for acid copper plating for high aspect ratio substrates “TOP LUCINA HLS”
The latest surface finish for FPC
- Electroless Cu plating process to LCP films for high-frequency and high-speed transmission “TOP LECS PROCESS”
- Additive for acid copper plating applicable to horizontal Roll to Roll plating equipment “TOP LUCINA SVP ”