OKUNO’s plating and surface finishing technology for PWBs and IC substrates

Surface finishing technology to glass core substrates

• Highly adhesive plating process on glass “TORIZING PROCESS”
• Acid copper plating additive for through-hole filling to glass core substrates “TOP LUCINA GCS series”

Plating technology for wafer

• UBM formation on aluminum electrode on wafer “TORYZA EL PROCESS”
• Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”
• Acid copper plating additive for semiconductor wafer “TORYZA LCN series”
• Acid copper plating additive for Cu-Cu hybrid bonding “TORYZA LCN LXD”