OKUNO’s plating and surface finishing technology for PWBs and IC substrates
Plating technology for semiconductor wafer
- Acid copper plating additive for wafer “TORYZA LCN series”
- UBM formation on aluminum electrode on wafer “TORYZA EL PROCESS”
- Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”
The latest surface finish for IC substrates
- Electroless copper plating process to solve Weak-Micro Via for high connection reliability “OPC FLET PROCESS”
- Acid copper plating additive for high-current density, fine pattern via filling “TOP LUCINA NSV ADV”
Acid copper plating additive for large diameter vias “TOP LUCINA NSV LV” - Electroless nickel-boron plating process on metal ink pastes of sintered substrates “TOP FCP PROCESS”