Product name

• UBM formation on aluminum electrodes on wafer “TORYZA EL PROCESS”
• Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”
• Acid copper plating additives for wafer “TORYZA LCN series”
• Acid copper plating additive for through-hole filling to glass substrates “TOP LUCINA GCS series”
• Crack inhibitor for aluminum hard anodizing “TOP STOUT AL-2”
• Acid copper plating additive for Cu-Cu hybrid bonding “TORYZA LCN LXD”