OKUNO’s plating and surface finishing technology for PWBs and IC substrates
Plating technology for semiconductor wafer
- UBM formation on aluminum electrode on wafer “TORYZA EL PROCESS”
- Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”
- Acid copper plating additive to silicon interposer for high aspect ratio filling “TORYZA LCN SV”
- Acid copper plating additive to FO-PLP/WLP for copper pillar formation “TORYZA LCN SP”
- Acid copper plating additive to low aspect via filling for high current, high heat radiation “TORYZA LCN SD”
- Acid copper plating additive for ultra-micro patterning “TORYZA LCN FRV”
Plating technology for IC substrates
- Electroless copper plating process to solve Weak-Micro Via “OPC FLET PROCESS”
- Acid copper plating additive for high-current density, fine pattern via filling “TOP LUCINA NSV ADV”
- Acid copper plating additive for large-diameter vias “TOP LUCINA NSV LV”
The latest surface finishing for power device
- For fine pattern formation, high joint reliability “Electroless nickel/gold plating process”
- Electroless plating process for power module ”