Exhibit Products

New technology

• Electroless Cu plating process for glass substrates “PLOPX”
• Dispersion of zirconia nanoparticles “CLEARTONE ZR”
• Coating for high electrical insulation and heat resistance “Protector HB-HR1”

Surface finish for power devices

• UBM formation process for Al electrodes on wafers “TOP UBP PROCESS W”
• Electroless plating process on Cu/Al clad ceramic boards “ICP NICORON LPW-LFN, TOP SILVE ACC, TOP SILVE AG”

Surface finish for IC substrates

 Multi-layer PWB

• Electroless Cu plating process for high connection reliability “OPC SUBLET PROCESS”
• Additive for acid copper plating with high via-filling performance to large diameter holes “TOP LUCINA GAP”
• Additive for acid copper plating for through-hole applicable to high electric current “TOP LUCINA MSD”

  Build-up PWB

• Additive for acid copper plating with high via-filling performance and thickness uniformity “TOP LUCINA HS5”
• Electroless Cu plating process to solve Weak-Micro Via “OPC FLET PROCESS”

 Final surface treatment

• Void-free final surface treatment using reduced cobalt catalyzing solution “ICP-COA PROCESS”

Surface finish for FPC

• Nickel seed layer forming process for polyimide films “TOP SAPINA PROCESS”
• Electroless Cu plating process to LCP films for high-frequency and high-speed transmission “TOP LECS PROCESS”
• Additive for acid copper plating applicable to Roll to Roll plating equipment “TOP LUCINA SVP”