Exhibit Products
Surface finishing for PWB and package in the next generation
- Additives for acid copper plating for ultra fine pattern “TOP LUCINA FRV”
- Additives for acid copper plating for large-diameter via-holes “TOP LUCINA GAP”
- Additives for acid copper plating high thickness uniformity “TOP LUCINA HS5”
- Additives for acid copper plating for wafer “TOP LUCINA SP/SV”
- Electroless copper plating process for ultra fine pattern formation “OPC FLET PROCESS”
- Electroless copper plating process for glass substrate “PLOPX PROCESS”
- Cobalt-reduced catalyzing process for void-free final surface treatment “ICP-COA PROCESS”
Plating technology for power device
- UBM formation process for aluminum electrodes on wafer “TOP UBP PROCESS W”
- Electroless Ni plating solution with strong crack resistance for power device “TOP UBP NICORON HRC”
- Electroless Ag, Ni/Ag plating on Cu “TOP SILVE ACC/AG”
Surface finishing for FPC -For high-speed communication-
- Additives for acid copper plating Applicable to Roll to Roll equipment “TOP LUCINA SVP”
- Electroless copper plating process to LCP films suitable for high-frequency, high-speed transmision “TOP LECS PROCESS”
Low-frequency
- Additives for electroplating For low-frequency electromagnetic shielding “TOP FENICK LFS”
- Electroless plating solution for low-frequency electromagnetic shielding “TOP CHEMIFENICK”