OKUNO’s plating and surface finishing technology for PWBs and IC substrates
Surface finishing for TGV
Acid copper plating additive for semiconductor wafer
- High speed acid copper plating additive for FO-PLP/WLP “TOP LUCINA SP”
- Acid copper plating additive for future mounting “TOP LUCINA SD”
- Acid copper plating additive for silicon interposer “TOP LUCINA SV”
RDL (Re Distribution layer) formation technology
- Acid copper plating additive with high filling power and thickness uniformity “TOP LUCINA FRV”
- Flash etching solution for sputtered copper layers “OPC SEED ETCHANT NE”
Plating technology for IC substrates
- Electroless copper plating process to solve Weak-Micro Via “OPC FLET PROCESS”
- Electroless copper plating for high connection reliability “OPC SUBLET PROCESS”
- Acid copper plating additive for high thickness uniformity and via-filling “TOP LUCINA HS5”
- Acid copper plating additive for large-diameter via holes “TOP LUCINA GAP”
- Acid copper plating additive for high current density and through hole plating “TOP LUCINA HLS”
- Void-free Ni/Au process using reduced cobalt catalyzing solution “ICP-COA PROCESS”
The latest surface finishing for power device
- Under barrier metal formation process for Al electrodes “TOP UBP PROCESS W”
- Electroless plating process to Cu/Al clad ceramic boards to power module ”